In a strategic pivot that could reshape the global semiconductor industry, Intel’s newly appointed CEO is reportedly weighing a major restructuring of the company’s historic manufacturing model. The company, long known for its vertically integrated structure where design and manufacturing were both managed in-house, may soon adopt a more flexible, outsourced model.

The move comes amid growing competition from rivals like Taiwan’s TSMC and South Korea’s Samsung, both of which have pulled ahead in producing smaller, more efficient chips. Industry insiders suggest Intel’s consideration of this dramatic shift signals a realization that staying competitive in a high-capital, fast-paced environment requires a leaner, more agile approach.

While details remain under wraps, sources close to the company say Intel could increasingly rely on third-party foundries to produce certain advanced chips—particularly those using next-generation nodes. This would allow Intel to focus more on design innovation and regain technological leadership without shouldering the entire burden of capital-intensive manufacturing.

The shift could also align Intel with broader geopolitical strategies, especially as the U.S. government pushes for chip sovereignty and domestic production. Analysts are split: some welcome the move as a long-overdue modernization, while others worry about risks to quality control and brand identity.

Ultimately, the decision could determine whether Intel reclaims its stature as a global leader—or continues to trail behind newer, more nimble rivals.